bga
基本解释
- (ball grid array, 球状矩阵排列)
英汉例句
- Fitting option BGA nozzle ensures excellent result and efficient.
选购专用BGA风咀,使拆焊效果更佳及操作更快捷。 - Desirable for high-performance Ball Grid Array (BGA) package.
高性能球形焊点阵列封装需要倒装焊。 - This method meets the needs of the on-line test of BGA coplanarity.
该测量方法可以满足BGA(球脚阵列)封装引脚尺寸的实时在线检测的需要。 - BGA measurement is measured for inside solder point.
BGA量测以最内侧焊点为量测依据。 - This procdure provides instruction for lead free BGA reballing process.
该程序为无铅。