flip chip bonding
常见例句
- To be an advancing technology in capsulation, there is a well developing foreground for the thermosonic flip-chip bonding.
热超声倒装键合作为前沿封装技术具有良好的发展前景。 - With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.
采用多普勒激光振动测量系统，获得了热超声倒装键合过程中工具末端及芯片的振动速度曲线。 返回 flip chip bonding